Optimization of the LDS process for the manufacture of MID components through the development of analytical methods for quality assurance

Author: Hefft, L.

3D-MID (Molded Interconnect Devices) technology is a versatile and flexible method for manufacturing highly functional components. It enables the direct integration of mechanical, electronic, and optical aspects within a single component, allowing for the production of components that combine diverse properties. For example, conductive traces can be integrated directly into a housing, thereby adding an electronic component to it.
Within the collaborative project, a detailed analysis of the necessary process steps is being conducted, and standardized analysis methods are being developed—particularly for the interfaces—to optimize the process chain and establish a comprehensive quality management system. The goal is to achieve increased process reliability and cost-effectiveness, as well as to introduce the technology into previously unexplored technological areas.
Combining the interdisciplinary expertise of all project partners enables a comprehensive approach with a deep understanding of the entire process chain and a subsequent technological leap forward upon completion of the project.